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  BUDA Prize in Mechanical Engineering, The University of Hong Kong
Event Organized by: Department of Mechanical Engineering, The University of Hong Kong
Co-organizer:
Sponsors: BUDA Group, UtilityINFO (HK) Ltd.
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Applications are invited for the BUDA Group-UtilityINFO (HK) Limited Prizes which are open to the third year undergraduate students following the B.Eng. degree curriculum in Mechanical Engineering or Building Services Engineering in the 2007/2008 academic year. Two prizes of the value of $5,000 each are available.

The Prizes shall be awarded on the basis of academic merit as shown in the B.Eng. Degree Examinations in the first two years of study and the quality of an essay written by the student on his/her career goals; participation in extra-curricular activities will be taken into account. Where candidates are of equal merit, preference will be given to those with greater financial needs. Shortlisted students are required to attend a selection interview in September, 2007.

Venue:
Enquiry Completed forms should be returned to the General Office of the Department of Mechanical Engineering by 5:00 p.m. on Friday August 31, 2007.
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